Solder Paste

- Low Reflow Temperature

The SP180 Series is a solder paste for low temperature that can be applied to SMT process and achieve excellent results under low temperature reflow condition

Application

  • - It can be used in the semiconductor equipment industry that requires SMT and die attach process as well as in low-temperature operation environment
  • - Optmized for printing process

    • Features and Advantages

  • - It uses halogen-free flux
  • - Less change over time during continuous printing and has a very consistent printing performance
  • - Excellent heat resistance even in low-temperature reflow
  • - Excellent wetting performance and minimizes void
  • - High Soldering reliability because of its little slump phenomenon after printing
  • - Excellent recovery system with less occurence of solder ball
  • - Effective response to Fine Pitch

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    Product Information

  • Metal Alloy : 42Sn57.6Bi0.4Ag, 42Sn58Bi can be customized
  • Test Package : Type 4(20~38um), Type 5 (15~25um), Type 6 (5~15um)
  • Packing : 500g, can be changed according to customer request

    • Physical Properties

    Spec Unit Value
    Color - Gray
    Activity Level - ROLO
    Specific Gravity - 8.7
    Thixotropic Index (TI) - 0.4~0.7
    Viscosity @25C Pa.S LV(40~80) MV(80~140) HV(140~230)
    Thermal Conductivity W/mK 40